Multilayer PCB - 6-layer circuit board

When engineers face "wiring congestion," "signal interference," and "space constraints" in high-complexity devices—from industrial PLCs to 5G base stations and medical ultrasound machines—the 6-layer circuit board emerges as a game-changer. Unlike 4-layer or 2-layer PCBs, its scientific lamination design (typical structure: Signal/Ground/Power/Signal/Ground/Signal) adds 2 extra power/ground planes, cutting electromagnetic interference (EMI) by up to 70% while compressing intricate circuits into compact spaces—critical for miniaturized, high-performance electronics.

6-layer circuit board

Core Advantages Backed by Professional Specifications

Crafted to meet industrial-grade reliability and precision demands, this 6-layer PCB stands out with tailored technical details:

Base Material & Thermal Stability: Adopts Grade A FR-4 (Tg 130–170°C) for general scenarios; optional Rogers high-frequency substrates (e.g., RO4350B) for 5G RF modules, ensuring dielectric constant stability (4.2–4.7 @ 1MHz for FR-4, 3.0–3.5 @ 10GHz for Rogers).

Lamination & Wiring Density: 6 layers with 3 independent signal layers, 2 power layers, and 1 ground layer; supports blind/buried vias (reducing 50% surface hole occupancy) and minimum line width/spacing of 3mil (0.076mm)—ideal for FPGA/CPU with 1000+ pins.

Copper Thickness & Surface Finish: Inner layers (0.5oz/17.5μm) for low-power signal transmission; outer layers (1–3oz/35–105μm) for high-current scenarios (e.g., automotive ECUs); ENIG finish (4–6μm Ni + 0.05–0.1μm Au) as standard, compatible with BGA soldering and 500+ insertion cycles.

Impedance Control: 50Ω (single-ended) / 100Ω (differential pair) ±10%, matching PCIe 4.0, DDR5, and 5G NR protocols—critical for 10Gbps+ high-speed signal integrity.

Industry-Specific Applications: Solving Real-World Pain Points

This 6-layer circuit board isn’t just a component—it’s a tailored solution for 3 key sectors:

Industrial Automation: Used in semiconductor wafer-cutting equipment’s PLC modules, the dual ground layers reduce signal crosstalk to -45dB, ensuring 24/7 stable operation of motion control systems.

5G Telecom: Integrated into 5G small base station RF processing boards, Rogers substrates and precise impedance control lower insertion loss to ≤-1.2dB, supporting 32GB/s data throughput for massive MIMO technology.

Medical Devices: Applied in portable ultrasound machines, its compact lamination (1.6mm standard thickness) and 168-hour high-temperature aging test (85°C/85% RH) meet medical-grade reliability, enabling clear image transmission without interference.

Authority & Customization Support

Compliant with IPC-6012 (performance), IPC-A-610 (acceptability), RoHS 2.0, and REACH; optional AEC-Q200 certification for automotive electronics. 

Need a tailored 6-layer circuit board? Share your device’s power, signal, and space requirements—reach out to the iPCB technical team for a customized solution.