Multilayer PCB - 8-Layer PCB

In scenarios where electronic systems demand higher integration, stricter signal isolation, and stable operation under harsh conditions—such as 5G base stations, industrial robotic controllers, or aerospace avionics—the 8-Layer PCB stands out as a core component. Unlike 4-layer or 6-layer PCBs, its optimized 8-layer stackup (typical structure: Signal/Ground/Power/Signal/Ground/Signal/Power/Signal) adds extra power and ground planes, effectively reducing electromagnetic interference (EMI) and signal crosstalk, while supporting dense wiring for complex ICs (e.g., FPGAs with 1000+ pins).

8-Layer PCB

Core Advantages: Material & Craftsmanship

Each 8-Layer PCB is manufactured to meet high-reliability standards, with key specifications tailored to diverse industry needs:

Base Material: Adopts high-Tg FR-4 (Tg 150–180°C) for general industrial use, ensuring resistance to high temperatures (-55°C to +125°C); optional Rogers substrates (e.g., RO4350B) for high-frequency scenarios (such as 5G RF modules), which maintains stable dielectric properties (3.0–3.5 @10GHz).

Structural Design: Standard thickness of 1.6mm (tolerance ±0.1mm), with customizable 2.0mm options for power-hungry devices; inner copper thickness of 0.5oz (≈17.5μm) for low-power signal transmission, and outer copper thickness of 1oz (≈35μm) (upgradable to 2oz ≈70μm for high-current modules like industrial PLC power units).

Surface Technology: Default ENIG (Electroless Nickel Immersion Gold) finish, with 0.05–0.1μm gold layer and 3–6μm nickel underlayer—ideal for fine-pitch BGA/QFN soldering; optional hard gold plating (0.5–2μm) for connectors or components requiring high wear resistance.

Technical Performance: Ensuring Signal & Operational Stability

To adapt to high-speed, high-complexity systems, the 8-Layer PCB adheres to strict technical indicators:

Dielectric Constant: 4.2–4.7 (@1MHz) for FR-4 base material, minimizing signal delay during data transmission;

Impedance Control: 50Ω (single-ended) / 100Ω (differential pair) with ±10% tolerance, perfectly matching high-speed protocols like PCIe 4.0 and 5G NR;

Fine Wiring Capability: Minimum line width/spacing of 3–5mil (0.076–0.127mm), enabling dense routing to accommodate compact electronic designs;

Noise Isolation: Through the separation of signal, power, and ground layers, crosstalk between circuits is reduced by over 60%, ensuring stable operation of precision equipment (e.g., medical diagnostic scanners).

Typical Applications: Covering Key High-Demand Sectors

The 8-Layer PCB is widely used in fields requiring high reliability and integration:

5G & Networking: 5G base station transceivers and high-speed routers—Rogers-based variants support 28GHz RF signals with low insertion loss, ensuring 10Gbps+ data throughput;

Industrial Automation: Robotic control modules and PLCs—high-Tg FR-4 material resists humidity and vibration in factory environments, maintaining 24/7 continuous operation;

Aerospace & Defense: Avionics navigation systems and satellite communication equipment—complies with strict temperature and anti-interference requirements, adapting to extreme space or high-altitude conditions;

Medical Devices: Ultrasound machines and biochemical analyzers—ENIG finish meets medical-grade hygiene standards, and multi-layer isolation prevents signal interference from affecting diagnostic accuracy.

Quality Assurance & Customization

All 8-Layer PCB products comply with IPC-6012 (performance standard) and IPC-A-610 (acceptability standard), and pass RoHS 2.0 and REACH environmental certifications; optional AEC-Q200 (automotive) or ISO 10993-1 (medical) certifications are available for industry-specific needs. We also offer customized services, such as black solder mask for better heat dissipation, or blind/buried vias to further improve wiring density.

For more details or customized solutions, contact the iPCB technical team.