Product Name: 8-layers Rigid-Flex PCB
Substrate: FR4 + PI
Stacked structure: FR4 4L+FLEX 4L
Finished board thickness: 0.2 mm+0.8mm
Copper plating thickness: 1 oz(35 μ m)
Surface treatment: chemical gold
Minimum line width/spacing: 5/5 mil
Minimum aperture: 0.2 mm
Product Applications: Instruments, Automotive
8-layers Rigid-Flex PCB
Our 8-layers rigid-flex PCB seamlessly merges the structural stability of rigid boards with the flexibility of flexible circuits, making it a perfect fit for space-constrained and vibration-sensitive applications in instruments and automotive electronics.
Key Features
Hybrid Substrate & Stacked Structure: Built with FR4 (for rigid parts) and PI (for flexible sections), the PCB uses a “FR4 4L + FLEX 4L” stacked design. This ensures both mechanical strength (for rigid areas) and bendability (for flexible regions) while maintaining reliable signal transmission.
Precise Thickness & Copper Plating: The finished board combines a 0.2mm-thick flexible portion and a 0.8mm-thick rigid portion, adapting to tight assembly spaces. With 1 oz (35 μm) copper plating, it offers excellent current-carrying capacity and signal integrity.
High-Precision Manufacturing: Boasts a minimum line width/spacing of 5/5 mil (0.127mm/0.127mm) and a minimum aperture of 0.2mm, enabling dense component placement and fine-pitch connections for complex designs.
Durable Surface Treatment: Chemical gold surface treatment enhances corrosion resistance, solderability, and long-term reliability—critical for harsh automotive and industrial environments.
Applications
This PCB excels in scenarios requiring compactness, durability, and complex form factors:
Industrial Instruments: Ideal for test equipment, measurement devices, and control systems where space efficiency and vibration resistance are vital.
Automotive Electronics: Suited for in-vehicle sensors, infotainment systems, and powertrain components that need flexible routing in tight engine bays or cabin spaces.
Technical Information
Product : 8-layers Rigid-Flex PCB
Substrate: FR4 + Polyimide (PI)
Stacked Structure: FR4 4L + FLEX 4L
Finished Board Thickness: 0.2mm (flexible part) + 0.8mm (rigid part)
Copper Plating Thickness: 1 oz (35 μm)
Surface Treatment: Chemical Gold
Minimum Line Width/Spacing: 5/5 mil
Minimum Aperture: 0.2 mm
Applications: Instruments, Automotive
Leverage this 8-layers rigid-flex PCB to simplify assembly, reduce wiring complexity, and boost system reliability in your next project. Contact the IPCB technical team for custom stackup adjustments, prototype testing, and volume production support tailored to your instrument or automotive system requirements.
Product Name: 8-layers Rigid-Flex PCB
Substrate: FR4 + PI
Stacked structure: FR4 4L+FLEX 4L
Finished board thickness: 0.2 mm+0.8mm
Copper plating thickness: 1 oz(35 μ m)
Surface treatment: chemical gold
Minimum line width/spacing: 5/5 mil
Minimum aperture: 0.2 mm
Product Applications: Instruments, Automotive
iPCB Circuit provides support for PCB design, PCB technology, and PCBA assembly. You can request technical consultation or quotation for PCB and PCBA here, please contact email: sales@ipcb.com
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