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Metal PCB

Metal PCB - Copper Power PCB

Metal PCB

Metal PCB - Copper Power PCB

  • Copper Power PCB
    Copper Power PCB

    Product: Copper Power PCB (High-current, high-thermal conductivity PCB for power electronics)

    Material:Copper Core (MCPCB): ≥380 W/m·K (EV chargers, industrial inverters).

    FR-4 Hybrid: High-Tg FR-4 

    Ceramic: Al₂O₃

    Quality standard: IPC-6018D, IPC-2221; ISO 9001, IATF 16949, UL 94 V-0, RoHS.

    Dielectric constant: FR-4 (4.2–4.7 @1MHz); Copper Core (3.5–4.0 @1MHz); Al₂O₃ ceramic (9.0–10.0 @1MHz).

    Layers: 4–32 layers (typical: 4-layer 2P+2S, 8-layer 4P+4S).

    Thickness: Substrate (FR-4: 0.4–3.0mm; Copper Core:1.0–5.0mm); Overall: 0.8–10.0mm.

    Copper thickness: 2oz–20oz (70μm–700μm); Power layers:3oz–6oz, Signal layers:1oz–2oz.

    Surface technology: ENIG (corrosion-resistant); Immersion Silver (low resistance); Lead-free HASL (rugged); OSP (eco-friendly).

    Special requirements: Current ≥500A (20oz); Temp: -55℃~+200℃ (ceramic), -40℃~+150℃ (others); AC 3000V voltage withstand.

    Application: EV (chargers, BMS), industrial (inverters, motor drives), aerospace (radar), medical (MRI power).


    Product Description Technical Information

    In the era of electrification and high-power electronics, traditional PCBs struggle to keep pace with the demands of extreme current, heat, and reliability. Enter Copper Power PCB—a game-changing solution engineered to handle 10A to 500A+ currents while mastering thermal management, setting new standards for performance in EVs, industrial systems, and aerospace technology.


    Unrivaled Current-Carrying Capability

    At the core of our Copper Power PCB lies its ultra-thick copper construction, ranging from 2oz (70μm) to 20oz (700μm) and customizable up to 1000μm. This robust design isn’t just about thickness—it’s about precision. Our proprietary stepped copper pattern technology, inspired by cutting-edge thermal engineering, increases contact area with heat-generating components by 40%, ensuring efficient current distribution even in 800V EV platforms and autonomous driving systems.

    For extreme applications, 20oz copper with a 20mm width safely carries 500A+, eliminating bulky busbars and reducing system size by 30%.


    Revolutionary Thermal Management

    Heat is the nemesis of high-power electronics, but our Copper Power PCB turns thermal challenges into strengths. We’ve integrated three innovations to redefine cooling efficiency:

    Embedded Heat Pipes: Ultra-thin 0.8mm heat pipes woven into non-routing areas create a "thermal highway," reducing hotspots by 5x in 100W+ power modules. In one EV battery management system (BMS) application, this design shrank temperature differences from 12℃ to just 3℃.

    Silver Sintering Technology: Replacing traditional solder with silver sinter materials (thermal conductivity >250W/m·K) cuts interface thermal resistance by 67%, ensuring IGBT junctions stay below 125℃ even under peak loads.

    Material Diversity: Choose from copper core (≥380 W/m·K), high-Tg FR-4 (Tg≥170℃), or ceramic substrates (AlN up to 280 W/m·K) to match your thermal needs. Ceramic options excel in aerospace and medical devices, operating reliably from -55℃ to +200℃.

    Copper Power PCB

    Copper power  PCB

    Engineered for Reliability & Compliance

    In critical applications where failure is not an option, our Copper Power PCB delivers uncompromising reliability:

    Certified Performance: Meets IPC-6018D for high-frequency integrity, IATF 16949 for automotive grade, and AS9100 for aerospace standards. Every board undergoes 1000 thermal cycles (-40℃~125℃) and 500 hours of salt-fog testing, ensuring impedance drift stays below 2%.

    Vibration & Stress Resistance: Reinforced with underfill epoxy and rigid-flex designs, it withstands 24G vibration in automotive radar systems and 50G shocks in aerospace equipment—critical for ADAS and satellite power modules.

    High-Voltage Safety: Withstands AC 3000V voltage and uses high-CTI materials (≥600V) to prevent partial discharge in 800V EV platforms, meeting IEC 60664 standards for creepage and clearance.


    Tailored Solutions for Every Industry

    Our Copper Power PCB adapts to your unique challenges:

    EV & Clean Energy: Powers 800V fast chargers and BMS with 10oz+ copper, reducing charging time by 25% while maintaining stable temperatures. The embedded copper busbars handle 200A continuous current without thermal shutdown.

    Industrial Automation: Drives inverters and motor controllers with 6oz copper layers and thermal vias (0.3mm diameter), boosting system efficiency by 15% in solar inverters and wind turbines.

    Aerospace & Medical: Ceramic-based variants support radar systems and MRI power modules, offering biocompatibility, ultra-low outgassing, and resistance to extreme altitude conditions.


    Partner for Innovation with iPCB Technical Team

    Beyond superior specs, our Copper Power PCB delivers peace of mind through tailored customization. Whether you need gradient copper thickness for balanced cost and performance, embedded heat management for extreme hotspots, or high-frequency impedance control (50Ω/100Ω) for RF-integrated power systems, the iPCB technical team leverages multi-physics simulation and DFM (Design for Manufacturability) support to optimize your design—from prototype validation to mass production scalability.

    Power your next breakthrough with a PCB that doesn’t just meet expectations—it redefines them. Connect with the iPCB technical team today to engineer your custom Copper Power PCB solution aligned with your current, thermal, and reliability goals.

    Product: Copper Power PCB (High-current, high-thermal conductivity PCB for power electronics)

    Material:Copper Core (MCPCB): ≥380 W/m·K (EV chargers, industrial inverters).

    FR-4 Hybrid: High-Tg FR-4 

    Ceramic: Al₂O₃

    Quality standard: IPC-6018D, IPC-2221; ISO 9001, IATF 16949, UL 94 V-0, RoHS.

    Dielectric constant: FR-4 (4.2–4.7 @1MHz); Copper Core (3.5–4.0 @1MHz); Al₂O₃ ceramic (9.0–10.0 @1MHz).

    Layers: 4–32 layers (typical: 4-layer 2P+2S, 8-layer 4P+4S).

    Thickness: Substrate (FR-4: 0.4–3.0mm; Copper Core:1.0–5.0mm); Overall: 0.8–10.0mm.

    Copper thickness: 2oz–20oz (70μm–700μm); Power layers:3oz–6oz, Signal layers:1oz–2oz.

    Surface technology: ENIG (corrosion-resistant); Immersion Silver (low resistance); Lead-free HASL (rugged); OSP (eco-friendly).

    Special requirements: Current ≥500A (20oz); Temp: -55℃~+200℃ (ceramic), -40℃~+150℃ (others); AC 3000V voltage withstand.

    Application: EV (chargers, BMS), industrial (inverters, motor drives), aerospace (radar), medical (MRI power).



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