Multilayer PCB - Drone HDI PCB

Engineered for high-performance unmanned aerial vehicles (UAVs), the Drone HDI PCB combines advanced high-density interconnect technology with purpose-built materials to solve critical drone challenges—from signal integrity in navigation systems to weight reduction for extended flight time. This circuit board serves as the backbone of reliable drone operations across commercial, industrial, and professional applications, balancing compact design with rugged environmental resilience .

Core Materials & Performance

The Drone HDI PCB leverages a hybrid material stack to meet diverse drone subsystem needs:

High-Tg FR-4 (Tg≥165℃): Delivers cost-effective thermal stability, resisting warpage during prolonged flight and temperature fluctuations—essential for consistent performance in consumer and industrial drones .

Rogers RO4003C: Optimized for high-frequency signals (e.g., GPS, 6GHz image transmission) with a dielectric constant of 3.35±0.1@1MHz-1GHz, minimizing signal loss for real-time HD video and precise navigation .

Polyimide (PI): Reduces overall drone weight by up to 25% compared to standard substrates while maintaining mechanical strength, directly extending battery life for long-duration missions .

Drone HDI PCB

Key Specifications for Drone Reliability

Every design element is tailored to UAV operational demands:

Layer Configuration: 6–22 layers enable dense integration of flight controllers, IMU sensors, and power management modules without increasing board size .

Board Thickness: 0.75–1.9mm strikes a balance—thinner profiles cut payload weight, while thicker options support high-power motor drivers .

Copper Thickness: 0.7oz–2.2oz ensures sufficient current-carrying capacity for LiDAR systems and stable signal conduction for sensitive flight control circuits .

Surface Finish: Primary ENIG (Electroless Nickel Immersion Gold) provides superior oxidation resistance and solderability for long-term connection reliability; optional hard gold/OSP suits high-plug-frequency data interfaces .

Drone-Specific Design Advantages

This HDI PCB addresses unique UAV pain points through targeted engineering:

Advanced Via Technology: 2nd-order+ buried/blind vias and laser microvias (min. 0.11mm) shorten signal paths, reducing crosstalk between GPS and motor control systems .

EMC Shielding Optimization: Minimizes electromagnetic interference from drone motors or external signals, critical for stable operation of 5G/6GHz communication modules .

Extreme Temperature Resilience: Operates reliably in -45℃~125℃, adapting to high-altitude cold, desert heat, and other harsh mission environments .

Quality & Compliance

Adhering to industry-leading standards, the Drone HDI PCB ensures long-term durability:

Meets IPC-A-600H Class3 (high-reliability electronics), AEC-Q200 (automotive-grade vibration/shock resistance), UL94 V-0 flame retardancy, and RoHS environmental regulations .

Undergoes rigorous testing for signal integrity and thermal performance, aligning with the demands of industrial inspection, agricultural surveying, and professional aerial photography drones .

Typical Applications

Ideal for critical drone subsystems:

Flight control units (precision attitude adjustment and navigation)

6GHz HD image transmission modules (real-time 1080P/4K video)

LiDAR navigation systems (accurate obstacle avoidance)

Industrial-grade power management modules (stable battery distribution to motors/sensors)