FR-4 PCB

Product: FR-4 PCB Board (General-purpose flame-retardant PCB, the most widely used base material for low-to-medium frequency electronics)

Material: Glass fiber-reinforced epoxy resin composite; optional variants:

Common grade: Tg 130°C–150°C, suitable for general electronics.

High-Tg grade: Tg ≥170°C, for high-temperature scenarios (e.g., lead-free soldering).

Halogen-free grade: No bromine/chlorine, compliant with eco-sensitive fields (medical, wearables).

Quality standard:

Safety: UL94 V-0 (flame retardancy, per UL 94 standard).

Industry specs: IPC-6012 (PCB performance), IPC-TM-650 (test methods).

Environmental: RoHS 2.0 (2011/65/EU), REACH compliant.

Dk: 4.2–4.8 @1MHz–1GHz (per IPC-TM-650 2.5.5.13)

Layers: 1–12 layers 

Thickness:

Substrate thickness: 0.4mm–3.2mm (customizable up to 8mm for thick-board needs).

Finished board thickness tolerance: ±0.1mm (for thickness ≥0.8mm, per IPC-6012).

Copper thickness: 0.5oz/ft² (18μm)–6oz/ft² (210μm); inner layers typically 0.5oz–1oz, outer layers optional thick plating (2oz–6oz) for high-current segments.

Surface technology:

HASL-LF (Lead-Free Hot Air Solder Leveling): Cost-effective, general-purpose.

ENIG (Electroless Nickel Immersion Gold): Flat surface, suitable for fine-pitch components (QFN/BGA) and gold fingers.

OSP (Organic Solderability Preservative): Eco-friendly, for single-reflow processes (short shelf life).

Immersion Silver/Tin: Enhanced solderability, for niche conductivity needs.

Special requirements:

High-Tg grade required for lead-free soldering (peak temp ≥260°C) or long-term use in 85°C+ environments.

Impedance control (50Ω/100Ω) needs manufacturer’s specific Dk value for simulation (Dk varies by batch).

Halogen-free grade mandatory for medical devices or EU eco-labeled products.

Application:

Consumer electronics: Smartphones, TVs, home appliances (refrigerators/washing machines).

Industrial: Control boards, sensors, low-frequency motor drivers.

Automotive: Non-high-frequency segments (infotainment, lighting control).

Power modules: Low-to-medium power DC-DC converters, LED drivers.

Product: Black Solder Mask PCB

Material: FR-4 substrate (A-grade, optional high-Tg variant with Tg 165–180°C for high-temperature scenarios); 

Black solder mask: Custom-formulated epoxy-based UV/thermal-curable ink 

Quality standard: IPC-6012 

Dielectric constant: FR-4 substrate: 4.3–4.7 @ 1MHz–1GHz; Black solder mask: 3.6–4.4 @ 1MHz (standard ink), 3.1–3.4 @ 1GHz (high-frequency optimized ink)

Layers: 1–24 layers (typical: 4–6 layers for consumer electronics; 8–16 layers for industrial/automotive applications)

Thickness: Substrate: 0.5–6.0mm; Overall board: 0.8–7.5mm (varies by layer count); Tolerance: ±0.08mm (for thickness ≥0.8mm)

Copper thickness: Inner layers: 0.5–2oz (17–70μm); Outer layers: 1–3oz (35–105μm)

Surface technology: ENIG (Electroless Nickel Immersion Gold) – Nickel layer: 4.5–5.5μm (phosphorus content 8%±0.5%); Gold layer: 0.06–0.09μm; Black solder mask thickness: 12–15μm (UV/thermal cured)

Special requirements: High-Tg substrate (Tg 165–180°C) required for -40°C~125°C operating environments; Storage: 23±2°C, 45%–55% humidity (vacuum-packed to prevent sulfur contamination of ENIG finish); Minimum line width/spacing: 4/4mil (0.1016/0.1016mm) with advanced laser direct imaging

Application: High-end consumer electronics (flagship smartphone RF boards, smart wearable devices, gaming console modules); Industrial/automotive (ADAS sensors, 5G small cell PCBs); Medical (diagnostic equipment signal-processing boards)

Product: Yellow FR-4 Circuit Board (Rigid PCB with yellow solder mask, offering reliable performance for electronics)

Material: FR-4 epoxy glass cloth laminate (Grade A); Yellow solder mask: Epoxy UV/thermal-curable ink (12-15μm); Optional high-Tg variant (Tg 170-180℃)

Quality standard: IPC-6012, IPC-A-600

Dielectric constant: Substrate: 4.3-4.7 @1MHz; Solder mask: 3.8-4.2 @1MHz; Optional high-frequency: 3.1-3.4 @1GHz

Layers: 1-32 layers (common: 1-20 layers)

Thickness: 0.2-6.0mm (standard 1.6mm); Custom: 0.1-7.0mm; Tolerance: ±0.1mm (≥0.8mm)

Copper thickness: Inner: 0.5-2oz; Outer: 1-3oz; High-power up to 10oz

Surface technology: HASL, ENIG (4.5-5.5μm Ni, 0.06-0.09μm Au); Optional: OSP, immersion silver/tin

Special requirements: High-Tg (≥170℃) for -40℃~155℃; Confirm AOI compatibility; ENIG/OSP recommended for high humidity

Application: Consumer electronics, industrial equipment, automotive electronics, medical instruments

Product: Motor PCB

Material: FR-4 (Grade A, Tg 130-160°C); Optional high-Tg (170-180°C) or MCPCB; High-temp epoxy solder mask (12-15μm)

Quality standard: IPC-6012, UL94 V-0

Dielectric constant: 4.3-4.7 

Layers: 4-16 layers (common: 4-8 layers)

Thickness: 0.8-3.2mm (standard 1.6mm); Tolerance ±0.1mm (≥0.8mm)

Copper thickness: Inner: 1-2oz; Outer: 2-3oz; High-power up to 5oz

Surface technology: ENIG (4-6μm Ni, 0.05-0.1μm Au); Optional HASL/OSP

Special requirements: High-Tg for ≥125°C; Thermal vias (0.3mm, 4+/cm²); EMI shielding; Overcurrent protection

Application: Industrial drives, automotive powertrains, consumer BLDC controllers, medical robot motors

Product: High-Density TWS Bluetooth Headphone Mainboard (Integrated for wireless audio, power management, sensor control)

Material: FR-4 (Grade A, Tg 130-150°C); Deep blue UV-curable solder mask (10-12μm)

Quality standard: IPC-6012 (Class 2/3)

Dielectric constant: 4.2-4.5 @1MHz; 50Ω ±10% impedance (RF paths)

Layers: 2-4 layers (standard); 6-layer HDI (premium models)

Thickness: 0.6-0.8mm (standard); 0.55mm ultra-thin option; Tolerance ±0.05mm

Copper thickness: 1oz (35μm); 0.5oz available for fine routing

Surface technology: ENIG (120-240μ" Ni, 1-5μ" Au); Supports 0.4mm BGA, 01005 components

Special requirements: 3mil/3mil line/space; 0.2mm min aperture; EMI shielding; 280°C reflow resistance

Application: TWS headphones (audio, battery, touch, noise cancellation); portable audio devices

Product: Half Hole PCB

Material: FR-4 (Grade A, Tg 130-160°C); Optional aluminum substrate for thermal management; Epoxy UV-curable solder mask (10-15μm)

Quality standard: IPC-6012, IPC-A-610

Half-hole specs:

Diameter: 0.3-1.0mm (standard 0.6mm, min 0.5mm with process control)

Spacing: ≥0.35mm (recommended ≥0.45mm)

Hole wall copper: ≥25μm (electroless copper plating + electrolytic plating)

Position accuracy: ±0.05mm (edge-aligned)

Layers: 1-24 layers (common: 2-8 layers for modular designs)

Thickness: 0.6-3.2mm (standard 1.6mm); Tolerance ±0.1mm (≥0.8mm)

Copper thickness: 0.5-3oz (17.5-105μm); High-power up to 5oz

Surface finish: ENIG (4-6μm Ni, 0.05-0.1μm Au); Optional HASL, OSP, immersion silver

Special requirements:

Half-hole to edge distance: ≥1mm

Solder mask opening over closed half-hole areas

Impedance control: 50Ω ±10% (for RF paths when needed)

Application: Modular electronics (motherboard-daughterboard links), LED modules, automotive sensors, smart wearables

Product: Golden Finger PCB

Material: FR-4 (Grade A, Tg 130-170°C); Optional TU-872 SLK (high-frequency) or aluminum substrate (thermal management); Epoxy solder mask

Quality standard: IPC-6012, IPC-A-610

Dielectric constant: 4.2-4.7

Layers: 1-32 layers (common: 6-8 layers for industrial use)

Thickness: 0.2-4.5mm (standard 1.6mm); Tolerance ±0.1mm (≥0.8mm)

Copper thickness: Inner: 0.5oz (17.5μm); Outer: 1-2oz (35-70μm); High-power up to 3oz

Surface technology: Selective gold plating on fingers (0.25-1.3μm); ENIG for other areas; Optional HASL/OSP

Special requirements: Finger chamfer angle 20°-90° (typical 45°); Finger pitch ≥0.15mm; Impedance control 50Ω ±10% (RF paths); ≥1mm distance from fingers to board edge

Application: Computers (RAM, graphics cards), industrial PLCs, telecom routers, aerospace avionics, consumer electronics (USB connectors)