Multilayer PCB - IC test board

IC Test Board serves as the core precision interface for verifying integrated circuits (ICs), directly linking automated test equipment (ATE) to IC wafers or packages. It solves the key challenge of reliable performance validation for high-speed, high-power, and high-pin-count devices—ensuring defects are detected before mass production, and reducing post-production failure costs by over 50%.

IC test board

Tailored Technical Highlights for Diverse Testing Needs

Every IC Test Board is engineered to match specific IC testing scenarios, with core specs aligned to real-world demands:

Substrate Selection: Uses Nelco N4000-13 EP (Tg 215°C) for general testing, Rogers RO4360G2 for 28–60GHz mmWave ICs (e.g., 5G transceivers), and aluminum-core FR-4 (thermal conductivity 0.8 W/m・K) for high-power devices like automotive IGBTs.

Structural Flexibility: Supports 4–40 layers (accommodating up to 8,000 IC I/Os) with a thickness range of 1.0–5.0mm (tolerance ±0.15mm)—striking a balance between wiring density and mechanical stability for repeated probing.

Copper & Surface Craft: Inner copper (0.5–2.0oz ≈17.5–70μm) ensures signal integrity, while outer copper (1.0–2.2oz ≈35–77μm) handles high-current test signals; surface finishes include hard gold (3.0–10μm, ≥10,000 probe cycles) and ENIG (0.05–0.11μm gold + 2.5–5μm nickel) for fine-pitch (≤50μm) testing.

Scene-Specific Adaptability for Key Industries

IC Test Board is customized to meet the unique demands of three high-growth sectors:

Automotive Electronics: Complies with AEC-Q200 standards, withstanding -40°C to +150°C thermal cycles and 10–2000Hz vibration—ideal for testing AEC-Q100 ICs and IGBTs in EV drivetrains.

5G Communications: Leverages Rogers RO4360G2 substrates to validate 28GHz/39GHz mmWave transceivers, maintaining 50Ω (single-ended) / 100Ω (differential) impedance (±8% tolerance) for high-speed signal transmission.

AI & HPC: 40-layer designs support validation of 5nm process AI accelerators and GPUs (with >5,000 pins), using blind/buried vias and laser direct imaging (LDI) to ensure alignment with sub-30μm IC pads.

Quality Assurance & Custom Solutions

All IC Test Board products meet IPC-6012 (Class 3), IPC-A-610, RoHS 2.0, and REACH standards. Custom options are available—from integrated heat sinks (for ICs with >100W power dissipation) to optional EMI shielding (for high-frequency environments).

To get tailored IC Test Board solutions or more technical details, contact the iPCB technical team.