Multilayer PCB

Product: 6-layer circuit board

Material: FR-4 (Grade A, Tg 130-170°C); Optional high-frequency substrates (e.g., Rogers) for RF applications; Green epoxy solder mask (10-15μm thickness)

Quality standard: IPC-6012 (performance specification), IPC-A-610 (acceptability criteria); RoHS 2.0, REACH compliant

Dielectric constant: 4.2-4.7 @ 1MHz (FR-4); 

Layers: 6 layers (typically 3 signal layers, 2 power layers, 1 ground layer; configurable based on design)

Thickness: 1.6mm (standard); Customizable 0.8-3.2mm; Tolerance ±0.1mm (for thickness ≥0.8mm)

Copper thickness: Inner layers: 0.5oz (17.5μm); Outer layers: 1oz (35μm); High-power variants: 2-3oz (70-105μm)

Surface technology: ENIG (4-6μm Ni, 0.05-0.1μm Au); Optional HASL (lead-free), OSP (organic solderability preservative)

Special requirements: Minimum line width/spacing: 3-5mil (0.076-0.127μm);

Application: Industrial control (PLCs, automation modules)

Product: Gold plated PCB 

Material: FR-4 (Tg 130–170°C) or Rogers (for high-frequency); Nickel underlayer + gold plating (purity ≥99.9%)

Quality standard: IPC-6012, ASTM B488, RoHS 2.0

Dielectric constant: 4.2–4.7 

Layers: 2–32 layers 

Thickness: 1.6mm (standard); Custom: 0.8–3.2mm (tolerance ±0.1mm)

Copper thickness: Inner: 0.5oz (≈17.5μm); Outer: 1oz (≈35μm) (up to 3oz for high-current needs)

Surface technology: ENIG (Electroless Nickel Immersion Gold, gold: 0.05–0.1μm; nickel: 3–6μm) or electroplated hard gold (0.5–2μm, for wear resistance)

Special requirements: Impedance control (50Ω±10% / 100Ω±10% for high-speed signals); Minimum line width/spacing: 3–5mil; High-temperature resistance

Application: 5G telecom base stations, medical diagnostic equipment, aerospace modules, industrial PLCs & robotics

Product: 8-Layer PCB

Material: FR-4 (Tg 150–180°C); Optional: Rogers (e.g., RO4350B) for high-frequency scenarios, or black solder mask FR-4 (for better heat dissipation or appearance)

Quality standard: IPC-6012, IPC-A-610

Dielectric constant: 4.2–4.7 

Layers: 8 layers (typical stackup: Signal/Ground/Power/Signal/Ground/Signal/Power/Signal, customizable)

Thickness: 1.6mm (standard); Custom: 2.0mm (tolerance ±0.1mm)

Copper thickness: Inner layers: 0.5oz (≈17.5μm); Outer layers: 1oz (≈35μm); High-current option: 2oz (≈70μm) for power modules

Surface technology: ENIG (Electroless Nickel Immersion Gold, 0.05–0.1μm gold); Optional: Hard Gold (0.5–2μm) for connectors or high-wear parts

Special requirements: Impedance control (50Ω±10% / 100Ω±10% for high-speed signals), minimum line width/spacing 3–5mil, blind/buried vias for dense wiring

Application: 5G networking devices (routers, base stations), industrial automation (PLCs, robotics), aerospace/defense (avionics, satellite modules), medical equipment (ultrasound, diagnostic scanners)

Product: Probe Card PCB

Material: Isola 370HR (Tg 180°C, Dk 4.04 @1MHz) or Rogers RO4350B (Dk 3.48 @10GHz) for high-frequency testing

Quality standard: IPC-6012, IPC-A-610, JEDEC JESD22

Dielectric constant: 4.0–4.5 

Layers: 14–42 layers 

Thickness: 1.8–4.8mm (tolerance ±0.15mm)

Copper thickness: Inner layers: 0.6–2.2oz (≈21–77μm); Outer layers: 0.9–2.0oz (≈31.5–70μm)

Surface technology: Hard gold plating (2.5–12μm) or ENIG (0.06–0.12μm gold) with nickel underlayer (3–6μm)

Special requirements: High-precision via placement (±6μm), depth-controlled drilling, metal cladding for structural stability

Application: 3nm/5nm logic chips, HBM3 memory modules, MEMS devices, automotive AI chips (AEC-Q200 compliant)

Product: IC Test Board 

Material: Standard - Nelco N4000-13 EP (Tg 215°C); High-frequency - Rogers RO4360G2 (28–60GHz); Thermal - Aluminum-core FR-4 (0.8 W/m・K)

Quality standard: IPC-6012 (Class 3)

Dielectric constant: 4.2–4.6 

Layers: 4–40 layers (supports up to 8,000 I/Os)

Thickness: 1.0–5.0mm (tolerance ±0.15mm)

Copper thickness: Inner: 0.5–2.0oz (≈17.5–70μm); Outer: 1.0–2.2oz (≈35–77μm)

Surface technology: Hard gold (3.0–10μm, ≥10,000 cycles); ENIG (0.05–0.11μm gold + 2.5–5μm nickel)

Special requirements: Integrated heat sinks/thermal vias; Optional EMI shielding; Blind/buried vias support

Application: Automotive (AEC-Q100 ICs/IGBTs); 5G (mmWave transceivers); AI/HPC (GPU/ASIC validation)

Product: Drone HDI PCB

Material: High-Tg FR-4 (Tg≥165℃), Rogers RO4003C, Polyimide (PI)

Quality standard: IPC-A-600H Class3, AEC-Q200, UL94 V-0, RoHS

Dielectric constant:

Rogers RO4003C: 3.35±0.1@1MHz-1GHz; 

FR-4: 4.4±0.2@1MHz-1GHz; PI: 10.1±0.3@1MHz-1GHz

Layers: 6-22 layers

Thickness: 0.75-1.9mm

Copper thickness: 0.7oz-2.2oz

Surface technology: ENIG (primary), optional hard gold/OSP

Special requirements: 2nd-order+ buried/blind vias, laser microvias (min. 0.11mm), EMC shielding optimization, -45℃~125℃ temperature resistance

Application: Drone flight control units, 6GHz HD image transmission modules, LiDAR navigation systems, industrial-grade power management modules

Product: Multilayer PCB

Material:

Core Substrates: High-Tg FR-4 (Tg≥145℃) for general use; Rogers RO4003C for high-frequency scenarios; S1139 modified epoxy for mixed-signal designs 

Prepregs: 106 for 4-6 layers

Quality standard: GB/T 4588.4-2017, IPC-6012E Class3, AEC-Q200, UL94 V-0, RoHS 2.0 & REACH compliant

Dielectric constant:

FR-4: 4.2±0.15@1MHz

Rogers RO4003C: 3.38±0.05@1GHz

S1139: 5.3±0.1@10GHz

Layers: Standard 4-34 layers; High-density option 55+ layers (aerospace/defense)

Thickness:

Board Thickness: 0.3-3.0 mm (customizable up to 5.8 mm)

Dielectric Thickness: 70-180 μm (standard); 55-68 μm (high-speed signals)

Copper thickness:

Inner Layers: 0.5-1.2 oz (17.5-42 μm)

Outer Layers: 1-2.2 oz (35-77 μm)

Ultra-Thick Copper: 4-6.5 oz (140-227 μm) for high-current modules

Surface technology:

Primary: ENIG (Ni 2.7-4.7 μm / Au 0.04-0.08 μm)

Options: OSP (0.15-0.4 μm), Hard Gold (0.08-0.27 μm), Lead-free HASL

Special requirements:

Impedance Control: ±4% tolerance (USB3.2: 90Ω±8%; HDMI 2.1: 100Ω±4%)

Thermal Management: Laser-drilled thermal vias (0.25 mm) + copper plane optimization (temp drop 12-14℃)

EMI Shielding: Signal-ground layer interleaving + shielded vias (crosstalk<1.2% in high-speed channels)

Mechanical Stability: Warpage ≤0.6% (boards ≥1.5 mm thickness); CTE-matched material stacks

Application:

Industrial: 5G small cells, PLC control systems, medical imaging equipment

Automotive: ADAS modules, in-vehicle radar, infotainment systems

Consumer Electronics: Smartphones, smart wearables, gaming consoles (0.35 mm BGA pitch)

Aerospace/Defense: Satellite communication equipment, radar systems (55+ layers)

Product: IC Substrate

Material:

Core: ABF (Tg≥185℃, CTE≤9.8 ppm/℃); BT resin (Tg≥182℃, CTE13.2–16.8 ppm/℃); Ceramic (AlN:138–178 W/(m·K), Si3N4:≥780 MPa)

Prepregs: 22–47 μm,resin content 31–37%

Quality standard: IPC-4101F, AEC-Q200, UL94 V-0, RoHS 3.0

Dielectric constant:

ABF: 3.48±0.1@1GHz; BT resin: 4.1±0.1@1MHz; Si3N4: 3.78±0.1@10GHz

Layers: Standard 2–14 layers (WB-BGA/CSP); High-density 6–22 layers (FCBGA)

Thickness:

Board: 0.14–1.9 mm (max 2.9 mm custom); Dielectric:13–46 μm

Copper thickness:

Inner/Outer:11–36 μm (0.32–1.05 oz); Ultra-thick:67–103 μm (1.95–3.0 oz)

Surface technology:

Primary: ENEPIG (Ni2.8–4.8μm/Pd0.09–0.24μm/Au0.04–0.09μm)

Options: Immersion Tin (1.2–2.5μm), OSP (0.14–0.38μm), Hard Gold (0.07–0.26μm)

Special requirements:

Fine-line: Min L/S 8/11 μm, microvia 53–142 μm

Impedance: ±4.8% (DDR5:100Ω, PCIe5.0:85Ω)

Thermal/Mechanical: Φ0.24mm thermal vias, warpage≤0.48%, peel strength≥1.15N/mm

Environmental: -55℃~155℃, 1050 cycles no delamination

Application:

HPC: Server CPUs, AI GPUs; Automotive: ADAS SoCs; Consumer: Smartphone SoCs; 5G: RF modules