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Product: Multilayer PCB
Material:
Core Substrates: High-Tg FR-4 (Tg≥145℃) for general use; Rogers RO4003C for high-frequency scenarios; S1139 modified epoxy for mixed-signal designs
Prepregs: 106 for 4-6 layers
Quality standard: GB/T 4588.4-2017, IPC-6012E Class3, AEC-Q200, UL94 V-0, RoHS 2.0 & REACH compliant
Dielectric constant:
FR-4: 4.2±0.15@1MHz
Rogers RO4003C: 3.38±0.05@1GHz
S1139: 5.3±0.1@10GHz
Layers: Standard 4-34 layers; High-density option 55+ layers (aerospace/defense)
Thickness:
Board Thickness: 0.3-3.0 mm (customizable up to 5.8 mm)
Dielectric Thickness: 70-180 μm (standard); 55-68 μm (high-speed signals)
Copper thickness:
Inner Layers: 0.5-1.2 oz (17.5-42 μm)
Outer Layers: 1-2.2 oz (35-77 μm)
Ultra-Thick Copper: 4-6.5 oz (140-227 μm) for high-current modules
Surface technology:
Primary: ENIG (Ni 2.7-4.7 μm / Au 0.04-0.08 μm)
Options: OSP (0.15-0.4 μm), Hard Gold (0.08-0.27 μm), Lead-free HASL
Special requirements:
Impedance Control: ±4% tolerance (USB3.2: 90Ω±8%; HDMI 2.1: 100Ω±4%)
Thermal Management: Laser-drilled thermal vias (0.25 mm) + copper plane optimization (temp drop 12-14℃)
EMI Shielding: Signal-ground layer interleaving + shielded vias (crosstalk<1.2% in high-speed channels)
Mechanical Stability: Warpage ≤0.6% (boards ≥1.5 mm thickness); CTE-matched material stacks
Application:
Industrial: 5G small cells, PLC control systems, medical imaging equipment
Automotive: ADAS modules, in-vehicle radar, infotainment systems
Consumer Electronics: Smartphones, smart wearables, gaming consoles (0.35 mm BGA pitch)
Aerospace/Defense: Satellite communication equipment, radar systems (55+ layers)
As the backbone of high-performance electronic systems, the Multilayer PCB integrates advanced material science and precision engineering to meet the demands of dense circuitry, stable signal transmission, and harsh operating environments. Designed for versatility across industries, this circuit board balances compact design with rugged reliability—making it a cornerstone for devices requiring complex functionality without compromising on performance .
Core Materials & Performance
The Multilayer PCB leverages a tailored material stack to address diverse technical needs:
High-Tg FR-4 (Tg≥145℃): Delivers cost-effective thermal stability for general-purpose electronics, resisting warpage during prolonged operation and temperature fluctuations .
Rogers RO4003C: Optimized for high-frequency applications (e.g., 5G communication), with a dielectric constant of 3.38±0.05@1GHz to minimize signal loss and ensure GHz-level transmission integrity .
S1139 Modified Epoxy: Ideal for mixed-signal designs, offering a dielectric constant of 5.3±0.1@10GHz and CTE≤12 ppm/℃ for mechanical stability in precision equipment .
Prepreg layers (106 for 4-6 layers, 2113 for 8+ layers) enhance bonding strength between conductive layers, critical for multi-layer durability .
Key Specifications for Versatility
Every dimension of the Multilayer PCB is engineered for adaptability:
Layer Configuration: 4-34 layers as standard, with high-density options of 55+ layers for aerospace and defense systems requiring extreme integration .
Board Thickness: 0.3-3.0mm (customizable up to 5.8mm), striking a balance between compactness for consumer devices and robustness for industrial machinery .
Copper Thickness: Inner layers (0.5-1.2oz) for signal integrity, outer layers (1-2.2oz) for component mounting, and ultra-thick copper (4-6.5oz) for high-current power modules .
Surface Finish: Primary ENIG (Ni 2.7-4.7μm / Au 0.04-0.08μm) for long-term solderability; optional OSP, hard gold, or lead-free HASL to match application needs .
Multilayer PCB
Design Advantages for Critical Systems
The Multilayer PCB incorporates targeted engineering to solve industry pain points:
Precision Impedance Control: ±4% tolerance (e.g., 90Ω±8% for USB3.2, 100Ω±4% for HDMI 2.1) eliminates signal distortion in high-speed channels .
Thermal Management: Laser-drilled thermal vias (0.25mm) and copper plane optimization reduce hotspot temperatures by 12-14℃, critical for power-intensive devices .
EMI Shielding: Signal-ground layer interleaving and shielded vias limit crosstalk to <1.2%, ensuring stable operation in electromagnetic-dense environments (e.g., automotive radar) .
Mechanical Stability: Warpage ≤0.6% for boards ≥1.5mm thick, with CTE-matched material stacks to withstand vibration and shock .
Quality & Compliance
Adhering to global standards, the Multilayer PCB guarantees long-term reliability:
Certified to IPC-6012E Class3, AEC-Q200 (automotive-grade), UL94 V-0 flame retardancy, and RoHS 2.0/REACH environmental regulations .
Undergoes rigorous testing (AOI, flying probe, thermal shock) to meet the stringent requirements of industrial, automotive, and aerospace applications .
Product: Multilayer PCB
Material:
Core Substrates: High-Tg FR-4 (Tg≥145℃) for general use; Rogers RO4003C for high-frequency scenarios; S1139 modified epoxy for mixed-signal designs
Prepregs: 106 for 4-6 layers
Quality standard: GB/T 4588.4-2017, IPC-6012E Class3, AEC-Q200, UL94 V-0, RoHS 2.0 & REACH compliant
Dielectric constant:
FR-4: 4.2±0.15@1MHz
Rogers RO4003C: 3.38±0.05@1GHz
S1139: 5.3±0.1@10GHz
Layers: Standard 4-34 layers; High-density option 55+ layers (aerospace/defense)
Thickness:
Board Thickness: 0.3-3.0 mm (customizable up to 5.8 mm)
Dielectric Thickness: 70-180 μm (standard); 55-68 μm (high-speed signals)
Copper thickness:
Inner Layers: 0.5-1.2 oz (17.5-42 μm)
Outer Layers: 1-2.2 oz (35-77 μm)
Ultra-Thick Copper: 4-6.5 oz (140-227 μm) for high-current modules
Surface technology:
Primary: ENIG (Ni 2.7-4.7 μm / Au 0.04-0.08 μm)
Options: OSP (0.15-0.4 μm), Hard Gold (0.08-0.27 μm), Lead-free HASL
Special requirements:
Impedance Control: ±4% tolerance (USB3.2: 90Ω±8%; HDMI 2.1: 100Ω±4%)
Thermal Management: Laser-drilled thermal vias (0.25 mm) + copper plane optimization (temp drop 12-14℃)
EMI Shielding: Signal-ground layer interleaving + shielded vias (crosstalk<1.2% in high-speed channels)
Mechanical Stability: Warpage ≤0.6% (boards ≥1.5 mm thickness); CTE-matched material stacks
Application:
Industrial: 5G small cells, PLC control systems, medical imaging equipment
Automotive: ADAS modules, in-vehicle radar, infotainment systems
Consumer Electronics: Smartphones, smart wearables, gaming consoles (0.35 mm BGA pitch)
Aerospace/Defense: Satellite communication equipment, radar systems (55+ layers)
iPCB Circuit provides support for PCB design, PCB technology, and PCBA assembly. You can request technical consultation or quotation for PCB and PCBA here, please contact email: sales@ipcb.com
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