PCBA Products

Product: RF PCB Assembly

Material: FR4, Rogers (RO4003C/RO4350B), PTFE, ceramic (AlN)

Quality standard: IPC-6012 Class 3, IEC 61189, RoHS 3.0

Dielectric constant: 2.0–10.1 @1–100GHz

Layers: 2–12 layers

Thickness: 0.1–2.4mm

Copper thickness: 1–5 oz

Surface technology: ENIG, hard gold plating

Special requirements: 1MHz–280GHz, 50Ω, ≤0.6dB insertion loss @28GHz, -55℃~125℃

Application: 5G/6G, radar, automotive ADAS, satellite communication

Product: LED PCBA (LED Circuit Board Assembly)

Material:FR4 (0.25–0.29 W/m·K, Tg140–190℃), aluminum (80–250 W/m·K), flexible PI/PET, ceramic (AlN ≥160 W/m·K)

Quality standard:IPC-6012, AEC-Q200, RoHS 3.0, UL94 V-0

Dielectric constant:PET:2.6–3.2;

FR4:4.0–4.6 @1MHz

Layers:1–4 layers (max 4 for complex designs)

Thickness:FR4:0.7–2.5mm; aluminum:0.9–3.3mm; flexible:0.07–0.19mm

Copper thickness:1–2.8oz (35–100μm)

Surface technology:OSP (0.18–0.46μm), ENIG (Ni2.4–4.6μm/Au0.02–0.07μm)

Special requirements:Thermal conductivity ≥0.25 W/m·K; flex cycles ≥11,000 (PI); -44℃~126℃ (750 cycles)

Application:Lighting (commercial/industrial), displays (MiniLED), automotive (headlights), medical (endoscopes)

Product: Drone PCBA 

Material:FR4 (Tg 140–180℃, 0.26–0.29 W/m·K), aluminum PCB (80–240 W/m·K), ceramic (AlN ≥165 W/m·K)

Quality standard:IPC-6012 (Class 2/3), AEC-Q200, RoHS 3.0, UL94 V-0

Dielectric constant:FR4: 4.0–4.5 @1MHz;

aluminum hybrid: 3.3–3.5 @6GHz

Layers:2–12 layers (max 12 for HDI designs)

Thickness:0.7–3.3 mm (FR4: 0.8–2.4 mm; aluminum: 1.0–3.2 mm)

Copper thickness:1–4 oz (35–140 μm)

Surface technology:OSP (0.18–0.45 μm), ENIG (Ni 2.5–4.5 μm / Au 0.02–0.06 μm), immersion silver (0.1–0.22 μm)

Special requirements:Operating temp: -40℃~125℃; vibration resistance: 18G+; IP65/67 (industrial)

Application:Consumer drones, industrial inspection UAVs, military drones, agricultural UAVs

Product: Power PCBA

Material:  FR4 (Tg 135–185℃, 0.26–0.29 W/m·K), aluminum PCB (85–245 W/m·K), ceramic (AlN ≥165 W/m·K)  

Quality standard:  IPC-6012 (Class 2/3)

Dielectric constant:  

FR4: 4.1–4.5 @1MHz; 

aluminum hybrid: 3.2–3.4 @6GHz  

Layers:  

2–10 layers (max 10 for complex designs)  

Thickness:  

0.7–3.2 mm (FR4: 0.8–2.4 mm; aluminum: 1.0–3.3 mm)  

Copper thickness:  

1–4 oz (35–140 μm)  

Surface technology:  

ENIG (Ni 2.5–4.5 μm / Au 0.02–0.06 μm), HASL, OSP (0.18–0.45 μm)  

Special requirements:  

Power handling: 100–2000W; operating temp: -40℃~125℃; voltage rating: 24–800V  

Application:  

EV chargers, solar inverters, industrial automation, battery management systems

Product: Radar PCBA (Radar Printed Circuit Board Assembly)  

Material: Rogers RO4350B/RO4003C, ceramic (AlN), high-Tg FR4  

Quality standard: IPC-6012 Class 3

Dielectric constant: 3.4–10.1 

Layers: 6–14 layers  

Thickness: 0.2–2.5mm  

Copper thickness: 1–5 oz  

Surface technology: ENIG, chemical nickel gold  

Special requirements: 24–79GHz, 50Ω±5%, -55℃~150℃, ≤0.6dB loss @77GHz  

Application: Automotive ADAS, military radar, industrial drone navigation

Product: Data card PCBA

Material: High-Tg FR4, Rogers RO4003C, ceramic (AlN)  

Quality standard: IPC-6012 (Class 2/3), IATF 16949, RoHS 3.0  

Dielectric constant: 4.1–10.0 @1–50GHz  

Layers: 4–12 layers  

Thickness: 0.8–2.5mm  

Copper thickness: 1–3 oz  

Surface technology: ENIG (Ni 2.2–4.5μm / Au 0.02–0.05μm)  

Special requirements: PCIe 2.0–4.0, 1.2–95 Gbps, -40℃~85℃ (industrial); -55℃~125℃ (aerospace)  

Application: Industrial automation, telecommunications (5G/6G), aerospace data processing

Product: RF System PCBA Board  

Material: Rogers, High-Tg FR4, Ceramic (AlN)  

Quality standard: IPC-6012 Class 3, MIL-STD-883  

Dielectric constant: 3.4–10.1 @ DC–38GHz  

Layers: 6–14 layers  

Thickness: 0.2–2.4mm  

Copper thickness: 1–5 oz  

Surface technology: ENIG  

Special requirements: 50Ω±5%, -40℃~150℃, ≤0.6dB @28GHz  

Application: 5G, military radar, automotive V2X

Product: Millimeter Wave Radar PCBA  

Material: Rogers, High-Tg FR4, Ceramic (AlN)  

Quality standard: IPC-6012 Class 3, IATF 16949  

Dielectric constant: 3.0–10.0 @24–79GHz  

Layers: 6–10 layers  

Thickness: 0.2–2.2mm  

Copper thickness: 1–2 oz  

Surface technology: ENIG  

Special requirements: 24–79GHz, 50Ω±5%, -40℃~150℃, ≤0.6dB @77GHz  

Application: Automotive ADAS, industrial sensors, defense radar

Product: FPGA

Material: High-Tg FR4, Rogers RO4003C, ceramic (AlN)  

Quality standard: IPC-6012 Class 3, MIL-STD-883, RoHS 3.0  

Dielectric constant: 3.4–10.0 @1–50GHz  

Layers: 8–14 layers  

Thickness: 0.8–2.5mm  

Copper thickness: 1–3 oz  

Surface technology: ENIG (Ni 2.2–4.5μm / Au 0.02–0.05μm)  

Special requirements: 850K–2.4M LEs, 14.2–27 Gbps transceivers, -40℃~85℃ (industrial)  

Application: 5G/6G base stations, aerospace radar, industrial automation