Rigid-Flex PCB

Product Name: 8-layers Rigid-Flex PCB

Substrate: FR4 + PI

Stacked structure: FR4 4L+FLEX 4L

Finished board thickness: 0.2 mm+0.8mm

Copper plating thickness: 1 oz（35 μ m）

Surface treatment: chemical gold

Minimum line width/spacing: 5/5 mil

Minimum aperture: 0.2 mm

Product Applications: Instruments, Automotive

Product: Detector Rigid-Flex PCB

Material:Rigid region: High-Tg FR4 (Tg≥160℃) or high-frequency laminates

Flexible region: Adhesiveless polyimide (PI)

Quality standard: IPC-6018F

Dielectric constant:Rigid: 4.3–4.7 (FR4)

Flexible region: 3.3–3.6 (PI)

Layers: 4–12 layers total; typical: 4R+2F

Thickness:

Rigid region: 0.8–1.2mm

Flexible region: 0.1–0.2mm

Overall: 0.3–1.5mm

Copper thickness:

Rigid region: 1 oz (typical)

Flexible region: ½ oz (dynamic bending)

Surface technology: ENIG, Immersion Silver, OSP

Special requirements:

Impedance control: ±5%

Dynamic bend life: >50,000 cycles

Operating temperature: -40℃~+125℃

Application: Medical (CT, capsule endoscopy), industrial (pipeline detection), automotive (77GHz radar)

Product: HDI Rigid-Flex PCB (High-Density Interconnect Rigid-Flex Printed Circuit Board)

Material:

Rigid: High-Tg FR4 (Tg≥170℃) / high-frequency laminates

Flexible: Adhesiveless PI (polyimide) 

Quality standard: IPC-2226A

Dielectric constant:

Rigid: 4.3–4.7 (FR4) / 3.5±0.1 (high-frequency)

Flexible: 3.4–3.6 (PI) / 3.7±0.2 (LCP)

Layers: 6–18 total 

Thickness:

Rigid: 0.6–1.4mm

Flexible: 0.08–0.25mm

Overall: 0.3–1.6mm

Copper thickness:

Outer: 1/4 oz–2 oz

Inner: 1/2 oz–2 oz

Surface technology: ENIG, Immersion Silver, OSP; selective hard gold

Special requirements:

Impedance control: ±6%

Laser microvia: Min 0.04mm (roughness ≤1μm)

Bending radius: ≥5x (static) / ≥25x (dynamic, >10,000 cycles)

Operating temp: -45℃~+130℃

Application: Foldable phones, 5G mmWave modules, automotive ADAS radar, medical endoscopes, aerospace inertial navigation

Product: Standard Rigid-Flex PCB

Material:Rigid: FR-4 (Tg≥140℃), High-Tg FR-4, halogen-free FR-4; optional Rogers (for RF applications).

Flexible: Polyimide (PI, heat resistance >260℃) / Polyester (PET, cost-effective).

Quality standard: IPC-6018F

Dielectric constant:Rigid: 4.2–4.7 (@1MHz, FR4); 3.5–4.0 (@10GHz, Rogers).

Flexible: 3.4–3.6 (@1MHz, PI); 3.2–3.4 (@1MHz, PET).

Layers: 4–12 total (rigid: 2–8; flexible: 1–4).

Thickness:

Rigid: 0.4–2.0mm.

Flexible: 0.07–0.12mm.

Overall: 0.1–1.5mm.

Copper thickness:

Rigid: 1/2 oz – 3 oz (typical 1 oz).

Flexible: 12–35μm (thin copper for enhanced flexibility).

Surface technology: ENIG, Immersion Silver, HASL (lead-free), OSP.

Special requirements:Bending radius: ≥6× flexible layer thickness (static); ≥10× (dynamic, >10,000 cycles).

Operating temperature: -40℃~+125℃ (PI); -20℃~+105℃ (PET).

Application: Wearable devices, foldable electronics, medical equipment, automotive/aerospace systems.

Product: Flex PCB, FPC

Substrate: PI, FR-4

Quality standard: IPC6012 class2 or class3

PCB Layers: 1Layer - 18Layers

Copper thickness: 1/1oz

Thickness: 0.1mm - 1.0mm

PCB structure: Standard or HDI FPC

Surface treatment: EING or OSP

Product application: Electronic products such as printer