RF PCB Board

Product: Millimeter Wave Radar PCB

PCB Substrate: Rogers RO3003G2+Isola 370HR

Quality standard: IPC6012 class2 or class3

DK of substrate: 3.00+/-0.04mm

PCB Layers: 4Layers - 12Layers

Copper thickness: 1/1oz

Thickness: 1.2mm - 2.0mm

PCB structure: with blind holes

Surface treatment: Silver, EING or OSP

Product application: Millimeter wave radar

Product: RT 5880 PCB

Material: Rogers RT/duroid® 5880 (glass microfiber-reinforced PTFE composite)

Quality Standard: IPC-6018D, UL 94 V-0 flammability rating

Dielectric Constant (Dk): 2.20 ± 0.02 @10GHz

Dissipation Factor (Df): 0.0009 @10GHz

Layers: 2–20 layers (customizable)

Thickness: 0.254mm (10mil) – 1.575mm (62mil)

Copper Thickness: 0.5oz (17μm) – 2oz (70μm)

Surface Technology: ENIG, OSP, bare copper

Special Requirements: ±4.5% impedance control, low water absorption (<0.02%), chemical resistance

Application: Satellite communication, automotive radar, 5G millimeter-wave, RF sensors

Product : High-Frequency PCB  
Materials: Rogers RO4003C  
Quality Standard: IPC-6012 Class 2 / Class 3 (supports blind/buried vias & impedance control)  
DK of Substrate: 3.38±0.05 at 10 GHz 
PCB Layers: 4–12 Layers (compatible with RO4400-series prepregs for multi-layer designs)  
Copper Thickness: ½ oz to 1 oz (standard foil).
Thickness:  
 - Base material: 0.203 mm – 1.524 mm  
 - Finished thickness: 0.6 mm – 2.0 mm (after lamination)  
PCB Structure: Blind/buried vias supported (FR4-compatible fabrication)  
Surface Treatment: OSP, Immersion Silver, ENIG (high-frequency preferred)  
Product Applications: 5G base station antennas/power amplifiers, millimeter-wave radar, satellite communication, high-speed server backplanes  
Special Notes:  
 - No UL94V-0 rating (select RO4350B for flame-retardant requirements).  
 - Z-axis CTE = 46 ppm/°C (ensures multi-layer thermal stability).  

Product : RO4350B PCB  

Material: Rogers RO4350B laminate  

Quality standard: IPC6012 Class II or Class III  

Dielectric constant: 3.48±0.05 @ 10 GHz  

Layers: 2 layer - 16 layer  

Thickness: 0.10mm - 1.52mm (core material)  

Copper thickness: Base copper ½ oz, finished copper thickness 1 oz (up to 2 oz available)  

Surface technology: Immersion Gold (ENIG), Immersion Silver, OSP  

Special requirements: Stable dielectric constant (low Dk tolerance), low dissipation factor (Df), UL94 V-0 flame retardancy  

Application: 5G base stations, automotive millimeter-wave radar, satellite communication systems

Product : Teflon PCB (Polytetrafluoroethylene PCB)

Material: Teflon laminate material (PTFE-based composite)

Quality standard: IPC 6012 Class II / Class III

Dielectric constant: 2.0–3.5 (2.17–2.40 @ 10 GHz for high-performance grades)

Layers: 2–34 layers

Thickness: 0.1 mm–12 mm

Copper thickness: Base copper: 0.5 oz; Finished copper: 1 oz

Surface technology: Plasma treatment (to enhance copper adhesion); Electroless Nickel Immersion Gold (ENIG), Immersion Silver, or OSP (organic solderability preservative)

Special requirements: Low water absorption (<0.01%); Thermal expansion coefficient (CTE) matching copper foil; Plasma surface conditioning for via reliability

Application: 5G base stations, automotive radar (77 GHz ADAS), satellite communication systems, aerospace avionics, RF/microwave modules, chemical processing equipment

Product: RF Microwave PCB  

Material: Rogers/ Taconic equivalents, PTFE composites, ceramic-filled laminates  

Quality standard: IPC-6018D, UL 94 V-0  

Dielectric constant: 2.2–10.1 @ 10GHz 

Layers: 2–32 layers  

Thickness: 0.12mm–11.5mm  

Copper thickness: 0.6–2.5 oz  

Surface technology: ENIG, Immersion Silver, OSP; plasma treatment for PTFE  

Special requirements: ±4.5% impedance control, thermal conductivity 0.73–2.7 W/m·K  

Application: 5G mmWave, automotive radar, satellite communication, medical RF devices

Technical Information

Product: RF Motherboard (Radio Frequency Motherboard)

Material: Rogers RO4350B, Taconic RF-35, ceramic-filled PTFE composites (customizable)

Frequency Range: 300MHz–100GHz

Quality Standard: IPC-6018D, IPC 6012 Class 2/3, UL 94 V-0; optional IATF 16949 (automotive)

Dielectric Constant: 2.2–3.5 @10GHz (±0.03–±0.05 tolerance)

Layers: 4–24 layers (custom stackup)

Thickness: 1.2mm–3.0mm

Copper Thickness: 1oz (signal), 2oz (power/ground); up to 4oz (high-power)

Surface Technology: Immersion Silver (＞12GHz), ENIG (≤12GHz), OSP

Special Requirements: ±4.5% impedance control; blind/buried vias; -40℃~+85℃ operation

Application: 5G, automotive radar, satellite communication, industrial IoT, medical devices