RF PCB Board - RO4003C PCB

Choose an excellent solution for your critical high-frequency designs. Our Rogers RO4003C PCB manufacturing service delivers unmatched electrical performance and reliability, and is certified to the highest industry standards. RO4003C is a ceramic-filled hydrocarbon-based laminate, suitable for applications with strict requirements for signal integrity, low loss, and stable dielectric properties.

We process this high-quality material into complex multi-layer circuit boards, providing core power for the next generation of wireless technology. Advanced manufacturing processes ensure precise impedance control and outstanding quality, making us a trusted partner for well-known enterprises in the aerospace, telecommunications, and automotive radar fields.

RO4003C PCB

Technical Specifications & Capabilities:

• PCB Substrate: Rogers RO4003C Laminate

• Dielectric Constant (Dk): 3.38±0.05 at 10 GHz (exceptional lot-to-lot consistency)

• Dissipation Factor (Df): 0.0027 at 10 GHz (ultra-low signal loss)

• Quality Standard: IPC-6012 Class 2 / Class 3 (meets the rigorous requirements for high-reliability applications)

• Layer Count: 4-12 Layers (utilizes RO4400-series prepregs for robust multi-layer bonding)

• Copper Thickness: Standard electrolytic copper foil, with thickness ranging from ½ oz to 1 oz

• Thickness Range:

◦ Core Material: 0.203 mm (8 mils) - 1.524 mm (60 mils)

◦ Finished Board: 0.6 mm - 2.0 mm after lamination

• Advanced Structures: Full support for blind vias, buried vias, and impedance control (tight tolerance of ±10% or better)

• Surface Finishes:

◦ Electroless Nickel Immersion Gold (ENIG) - recommended for high-frequency performance scenarios

◦ Immersion Silver

◦ Organic Solderability Preservative (OSP)

(Consult theIPCB technical team to select the optimal option for your design)

• Thermal Reliability: Z-axis Coefficient of Thermal Expansion (CTE) is 46 ppm/°C, ensuring excellent plated through-hole integrity and thermal stability in multi-layer structures