RF PCB Board - RO4350B PCB

Engineered for the rigorous requirements of high-reliability RF systems, the Rogers RO4350B PCB integrates exceptional electrical performance with UL94 V-0 flame retardancy—a unique distinction in the Rogers RO4000 series. Constructed from a high-performance woven glass-reinforced hydrocarbon/ceramic laminate, it delivers stable dielectric properties, minimal signal loss, and robust thermal-mechanical stability, making it the ideal choice for 5G infrastructure, automotive radar, and aerospace applications where safety and signal integrity are non-negotiable priorities.

RO4350B PCB

Core Performance Advantages

Stable Dielectric Control

Dielectric Constant (Dk): 3.48±0.05 @ 10 GHz (negligible variation across frequencies; 3.47 @ 24 GHz, with a 3.66 design reference for 8–40 GHz), ensuring consistent impedance for high-frequency signal propagation.

Ultra-Low Loss: Dissipation factor (Df) = 0.0037 @ 10 GHz, minimizing signal attenuation in long-range, high-speed connections (e.g., 5G millimeter-wave communications).

UL94 V-0 Flame Retardancy

As the sole material in the Rogers RO4000 series holding a UL94 V-0 classification, it complies with fire-safety standards for enclosed systems, including active RF modules and high-power amplifiers—eliminating fire risks in critical installations.

Thermal & Mechanical Robustness

Z-Axis CTE: 32 ppm/°C (30% lower than RO4003C).

High Thermal Endurance: Glass transition temperature (Tg) > 280°C and decomposition temperature (Td) 390°C, enabling lead-free soldering (260°C reflow processes) and reliable operation in harsh environments (e.g., automotive under-hood conditions).

Technical Specifications

Substrate: Rogers RO4350B high-performance woven glass-reinforced hydrocarbon/ceramic laminate

Quality Compliance: IPC-6012 Class II / Class III

Layer Count: 2–16 layers (supports blind/buried vias for high-density integration)

Thickness: Core material: 0.10 mm (4 mil) – 1.52 mm (60 mil); Finished board: Customizable via RO4400-series prepregs

Copper Thickness: Base copper: ½ oz (18 μm); Finished copper: 1 oz (35 μm), with options up to 2 oz; Optional: LoPro low-roughness copper foil (reduces conductor loss by 15%)

Surface Finishes: Electroless Nickel Immersion Gold (ENIG) – preferred for high-frequency performance; Immersion Silver; Organic Solderability Preservative (OSP)

Special Design Features

FR4-Compatible Manufacturing: Utilizes standard FR4 processing workflows (no specialized equipment needed), reducing production costs by 40–60% versus PTFE-based PCBs while maintaining high-frequency performance.

CAF Resistance: Endures harsh environmental conditions (humidity, temperature cycling) to inhibit conductive anodic filament (CAF) formation, safeguarding long-term reliability in demanding applications.

Target Applications:

5G Infrastructure: Base station antennas, power amplifiers (PAs), and small cells (optimized for 24–40 GHz millimeter-wave bands).

Automotive Radar: 77 GHz ADAS sensors (maintains thermal stability across -40°C to 150°C operating ranges).

Aerospace & Defense: Satellite communication (SATCOM) systems, phased array antennas, and high-power RF modules (meets strict aerospace reliability benchmarks).

Industrial & IoT: Broadband microwave links, RFID systems, and high-precision sensing devices (delivers consistent performance in industrial environments).