Product: RT 5880 PCB
Material: Rogers RT/duroid® 5880 (glass microfiber-reinforced PTFE composite)
Quality Standard: IPC-6018D, UL 94 V-0 flammability rating
Dielectric Constant (Dk): 2.20 ± 0.02 @10GHz
Dissipation Factor (Df): 0.0009 @10GHz
Layers: 2–20 layers (customizable)
Thickness: 0.254mm (10mil) – 1.575mm (62mil)
Copper Thickness: 0.5oz (17μm) – 2oz (70μm)
Surface Technology: ENIG, OSP, bare copper
Special Requirements: ±4.5% impedance control, low water absorption (<0.02%), chemical resistance
Application: Satellite communication, automotive radar, 5G millimeter-wave, RF sensors
Engineered for demanding high-frequency applications, RT 5880 PCB stands out as a premier choice for RF engineers and system designers requiring exceptional signal integrity. Based on Rogers’ RT/duroid® 5880 laminate—a glass microfiber-reinforced PTFE composite—this high-performance circuit board delivers unmatched dielectric stability and ultra-low loss across broadband and millimeter-wave frequencies.
Key Technical Advantages
RT 5880 vs. RT 5870: Choosing the Right Material
While both RT 5880 and RT 5870 are glass microfiber-reinforced PTFE composites optimized for high-frequency applications, key differences in dielectric properties and thermal behavior make each suited for distinct use cases:
Dielectric Constant (Dk) @10GHz: RT 5880 has a Dk of 2.20 ± 0.02, while RT 5870 measures 2.33 ± 0.02. This lower Dk in RT 5880 reduces signal delay, making it ideal for systems operating above 28GHz, such as 5G FR2 millimeter-wave networks.
Dissipation Factor (Df) @10GHz: RT 5880 features an ultra-low Df of 0.0009, compared to RT 5870’s 0.0012. This ~25% reduction in signal loss makes RT 5880 critical for long-range applications like radar systems and satellite communication links, where signal integrity directly impacts performance.
Thermal Expansion (CTE): RT 5880 exhibits a CTE of 22 ppm/°C (X-axis) and 31 ppm/°C (Y-axis), while RT 5870 measures 28 ppm/°C (X-axis) and 48 ppm/°C (Y-axis). RT 5880’s lower X/Y-axis CTE ensures better dimensional stability, reducing warpage in multi-layer designs—a key advantage for complex RF modules.
Peel Strength: With 1oz electrodeposited (ED) foil, RT 5880 achieves 31.2 lbs/in (5.5 N/mm) peel strength, compared to RT 5870’s 27.2 lbs/in (4.8 N/mm). This stronger copper adhesion makes RT 5880 better suited for high-reliability applications like aerospace and defense systems.
Water Absorption: Both materials share identical low water absorption (0.02%), ensuring reliable performance in humid or harsh environments.
Ultra-Low Signal Loss: Features an extremely low dissipation factor (Df) of 0.0009 @10GHz, minimizing insertion loss even at Ku-band and above. This makes it ideal for high-data-rate communication systems where signal integrity directly impacts transmission range and reliability.
Broad Frequency Compatibility: Optimized for operation from hundreds of MHz to tens of GHz, seamlessly supporting applications in 5G FR2 (26–40GHz), satellite communication, and millimeter-wave radar systems.
Mechanical & Environmental Resilience: Exhibits excellent dimensional stability and chemical resistance, withstanding harsh solvents and temperature extremes. UL 94 V-0 flammability rating ensures safety in automotive and aerospace environments.
RT 5880 PCB offers flexible design possibilities to match specific application needs:
- Layer Count: 2–20 layers, with support for HDI (High-Density Interconnect) and hybrid designs for complex RF front-ends.
- Thickness: Available in standard configurations from 0.254mm (10mil) to 1.575mm (62mil), with tight tolerances for precise impedance control.
- Copper Cladding: 0.5oz (17μm) to 2oz (70μm) electrodeposited or rolled copper options, with reverse-treated foil available for enhanced adhesion and signal performance.
- Surface Finishes: Customizable with ENIG (Electroless Nickel Immersion Gold), OSP, or bare copper, optimized for soldering reliability and long-term corrosion resistance.
Every RT 5880 PCB adheres to stringent quality standards, including:
- IPC-6018D compliance for high-frequency PCBs
- 100% electrical testing prior to shipment
- Plasma treatment for improved PTFE-to-copper adhesion
- Support for advanced features like blind vias and cavity designs for compact module integration
RT 5880 PCB excels in mission-critical high-frequency systems:
- Satellite communication terminals (Ka-band transceivers)
- 77/81GHz automotive radar and ADAS systems
- Point-to-point digital radio antennas and base stations
- Millimeter-wave sensors and imaging systems
- Phased array antennas and RF front-end modules
Product: RT 5880 High-Frequency PCB
Material: Rogers RT/duroid® 5880 (glass microfiber-reinforced PTFE composite)
Quality Standard: IPC-6018D, UL 94 V-0 flammability rating
Dielectric Constant (Dk): 2.20 ± 0.02 @10GHz
Dissipation Factor (Df): 0.0009 @10GHz
Layers: 2–20 layers (customizable)
Thickness: 0.254mm (10mil) – 1.575mm (62mil)
Copper Thickness: 0.5oz (17μm) – 2oz (70μm)
Surface Technology: ENIG, OSP, bare copper
Special Requirements: ±4.5% impedance control, low water absorption (<0.02%), chemical resistance
Application: Satellite communication, automotive radar, 5G millimeter-wave, RF sensors
Elevate your high-frequency design with RT 5880 PCB’s unmatched combination of low loss, dielectric stability, and design flexibility. Partner with the IPCB technical team for custom stackup designs, rapid prototyping, and volume production support.
RT5880 PCB
Product: RT 5880 PCB
Material: Rogers RT/duroid® 5880 (glass microfiber-reinforced PTFE composite)
Quality Standard: IPC-6018D, UL 94 V-0 flammability rating
Dielectric Constant (Dk): 2.20 ± 0.02 @10GHz
Dissipation Factor (Df): 0.0009 @10GHz
Layers: 2–20 layers (customizable)
Thickness: 0.254mm (10mil) – 1.575mm (62mil)
Copper Thickness: 0.5oz (17μm) – 2oz (70μm)
Surface Technology: ENIG, OSP, bare copper
Special Requirements: ±4.5% impedance control, low water absorption (<0.02%), chemical resistance
Application: Satellite communication, automotive radar, 5G millimeter-wave, RF sensors
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