Product: Transparent Circuit Board
Material:
Substrate: PI (transmittance 84%-87%, -195℃~258℃), PET (0.09-0.19mm thickness), tempered low-iron glass (transmittance 90%-91%); transparent FR-4 optional
Conductive layer: ITO (transmittance 84%, 9-48Ω/□), graphene (96% transmittance, 28-98Ω/□), silver nanowire (4-19Ω/□)
Quality standard: CY/T 275-2024, IPC-2221 (Class 3), AEC-Q200 (automotive-grade), RoHS 3.0, UL94 V-0
Dielectric constant:
PI: 3.0-3.4@1MHz; PET: 2.8-3.2@1MHz; transparent FR-4: 4.2-4.6@1MHz
Layers: Single layer (standard); double/four layers (optional); max. 6 layers (complex circuits)
Thickness:
Substrate: PI 0.06-0.19mm; glass 0.55-4.8mm; PET 0.09-0.19mm
Total thickness: 0.08-4.9mm
Copper thickness:
Local copper foil: 6-33μm (auxiliary circuits); hole wall copper:7-24μm
Conductive layer (ITO/graphene):42-185nm
Surface technology:
Primary: ENEPIG (Ni 2.7-4.6μm / Pd 0.07-0.22μm / Au 0.02-0.07μm)
Options: OSP (0.21-0.48μm), immersion silver (0.12-0.23μm)
Special requirements:
Transmittance ≥83%; flex resistance (PI): 92,000+ bends (R=3.2mm)
Thermal cycle: -53℃~286℃ (1000 cycles, no delamination)
Min line/space: ≥4.2/4.2mil; insulation resistance ≥10¹²Ω
Application:
Consumer electronics: Transparent displays, flexible wearables
Automotive: HUD systems, LiDAR modules
Medical: Minimally invasive endoscopes
New energy: Transparent photovoltaic curtain walls
